Patent Assignment
Reel/Frame 015066/0526
Assignment of Assignor's Interest
Recorded: 2004-03-08
Pages: 3
Assignors
KIM, DONG-SU
Executed: 2004-03-02
PARK, HYO-HOON
Executed: 2004-03-02
CHO, HAN-SEO
Executed: 2004-03-02
RHO, BYUNG-SUP
Executed: 2004-03-02
JUNG, SUN-TAE
Executed: 2004-03-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Packaging Apparatus for Optical Interconnection on Optical Printed Circuit Board