Patent Assignment
Reel/Frame 015071/0142
Assignment of Assignor's Interest
Recorded: 2004-08-18
Pages: 2
Assignor
LACOURT, PHILIP ROLAND
Executed: 2003-09-25
Assignee
E.I. DU PONT DE NEMOURS AND COMPANY
1007 MARKET STREET, LEGAL PATENTS, WILMINGTON, DELAWARE, 19898
Covered Property
(1)
Dielectric Substrates Comprising a Polymide Core Layer and a High Temperature Fluoropolymer Bonding Layer, and Methods Relating Thereto
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 21, 2004
From: LACOURT, PHILIP ROLAND
To: E.I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 014879/0551 →
Assignment of Assignor's Interest
Aug 11, 2004
From: LACOURT, PHILIP ROLAND
To: E.I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 015018/0595 →
Assignment of Assignor's Interest
Jun 25, 2019
From: E. I. DU PONT DE NEMOURS AND COMPANY
To: DUPONT ELECTRONICS, INC.
Reel/Frame 049583/0269 →