Patent Assignment
Reel/Frame 015085/0242
Assignment of Assignor's Interest
Recorded: 2004-08-25
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Multi-Chip Package and Fabrication Method