Patent Assignment
Reel/Frame 015097/0356
Assignment of Assignor's Interest
Recorded: 2004-03-17
Pages: 3
Assignee
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Wafer and a Methd for Manufacturing a Semiconductor Wafer