Patent Assignment
Reel/Frame 015133/0180
Assignment of Assignor's Interest
Recorded: 2004-03-23
Pages: 3
Assignors
YOON, JEONG GOO
Executed: 2004-02-25
OH, BANG WON
Executed: 2004-02-25
YI, KUK HWEA
Executed: 2004-02-25
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN-3-DONG, YOUNGTONG-KU, KYUNGKI-DO, SUWON, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Separating Sapphire Wafer into Chips
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.