Patent Assignment
Reel/Frame 015149/0729
Assignment of Assignor's Interest
Recorded: 2004-03-29
Pages: 3
Assignors
LEE, HSIN-HUI
Executed: 2004-03-11
HUANG, CHIEN-CHAO
Executed: 2004-03-16
WANG, CHAO-HSIUNG
Executed: 2004-03-17
YANG, FU-LIANG
Executed: 2004-03-17
HU, CHENMING
Executed: 2004-03-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
NO. 8, LI-HSIN ROAD 6, SCIENCE-BASED INDUSTRIAL PRK, HSIN-CHU 300-77, TAIWAN
Covered Property
(1)
Method for Dicing Semiconductor Wafers