Patent Assignment
Reel/Frame 015152/0974
Assignment of Assignor's Interest
Recorded: 2004-03-25
Pages: 2
Assignee
DENSO CORPORATION
1-1, SHOWA-CHO, KARIYA-CITY, ALCHI-PREF, 448-8661, JAPAN
Covered Property
(1)
Molded Semiconductor Device with Heat Conducting Members