Patent Assignment
Reel/Frame 015158/0341
Assignment of Assignor's Interest
Recorded: 2004-03-29
Pages: 3
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN-3-DONG, YOUNGTONG-KU, SUWON, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Separating Sapphire Wafer into Chips Using Dry-Etching
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.