Patent Assignment
Reel/Frame 015212/0482
Assignment of Assignor's Interest
Recorded: 2004-04-15
Pages: 2
Assignor
OGAWA, TSUYOSHI
Executed: 2004-03-25
Assignee
SONY CORPORATION
7-35, KITASHINAGAWA 6-CHOME SHINAGAWA-KU, TOKYO, 141, JAPAN
Covered Property
(1)
Multichip Module, Manufacturing Method Thereof, Multichip Unit and Manufacturing Method Thereof