Patent Assignment
Reel/Frame 015221/0688
Assignment of Assignor's Interest
Recorded: 2004-04-14
Pages: 4
Assignee
SUN MICROSYSTEMS, INC.
4150 NETWORK CIRCLE, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Lidless Chip Package Effectively Having Co-Planar Frame and Semiconductor Die Surfaces
Patent:
7,030,484 →
Application:
10/824,455 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.