Change of Name

Recorded: 2004-10-12 Received: 2004-10-12 Pages: 57

Assignor

LG SEMICON CO., LTD.

Executed: 1999-07-26

Assignee

HYNIX SEMICONDUCTOR INC.

SAN 136-1, AMI-RI, BUBAL-EUB, ICHON-SHI, KYOUNGKI-DO, KRX, KOREA, REPUBLIC OF

Covered Properties (5)

Charge Coupled Device and Method of Fabricating the Same

Application: 10/086,520 →

User Initiated Microcode Modification

Application: 09/927,398 →

Solid State Ccd Image Sensor Having a Light Shielding Layer

Application: 09/879,061 →

Solid State Image Sensor Device and Method of Fabricating the Same

Application: 09/809,284 →

Molding Nozzle Gate Valve

Application: 09/794,672 →