Patent Assignment
Reel/Frame 015263/0715
Assignment of Assignor's Interest
Recorded: 2004-04-20
Pages: 3
Assignors
CHANG, SHYH-MING
Executed: 2004-03-22
HUANG, YUAN-CHANG
Executed: 2004-03-22
CHEN, WEN-CHIH
Executed: 2004-03-22
YANG, SHENG-SHU
Executed: 2004-03-22
Assignee
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
NO. 195, SEC. 4, CHUNG HSING ROAD, HSINCHU, TAIWAN
Covered Property
(1)
Bonding Structure with Compliant Bumps