Assignment of Assignor's Interest

Recorded: 2004-04-20 Pages: 2

Assignor

SU, HUAN-PING

Executed: 2004-03-26

Assignee

ULTRATERA CORPORATION

NO. 2, LI-HSIN ROAD, 3, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, R.O.C., TAIWAN

Covered Property (1)

Method of Manufacturing Semiconductor Packages and a Clamping Device for Manufacturing a Semiconductor Package

Patent: 6,933,178 →

Application: 10/829,411 →

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.