Patent Assignment
Reel/Frame 015266/0157
Assignment of Assignor's Interest
Recorded: 2004-04-26
Pages: 2
Assignors
NOMURA, TOHRU
Executed: 2004-04-15
SHIMOIDE, YOSHIHIRO
Executed: 2004-04-15
SHIRAISHI, YOSHIHIKO
Executed: 2004-04-15
KAMIMURA, RIKIYA
Executed: 2004-04-15
KASUGAI, HIROSHI
Executed: 2004-04-15
Assignee
DENSO CORPORATION
1-1 SHOWA-CHO, KARIYA-CITY, AICHI-PREF., 448-8661, JAPAN
Covered Property
(1)
Thick Film Circuit Board, Method of Producing the Same and Integrated Circuit Device