Patent Assignment
Reel/Frame 015273/0012
Assignment of Assignor's Interest
Recorded: 2004-04-30
Pages: 2
Assignor
CHUNG, CHIH-MING
Executed: 2004-04-20
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
NO. 26, CHIN 3RD RANTZE EXPORT, PROCESSING ZONE, KAOHSIIUNG, TAIWAN
Covered Property
(1)
Stacked Flip Chip Package