Patent Assignment
Reel/Frame 015275/0313
Assignment of Assignor's Interest
Recorded: 2004-04-30
Pages: 3
Assignee
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
20555 SH 249, HOUSTON, TEXAS, 77070
Covered Property
(1)
System and Method for Direct-Bonding of Substrates