Patent Assignment
Reel/Frame 015276/0929
Assignment of Assignor's Interest
Recorded: 2004-04-29
Pages: 3
Assignors
TERUI, MAKOTO
Executed: 2003-12-01
TANAKA, YASUO
Executed: 2003-12-01
NOGUCHI, TAKASHI
Executed: 2003-12-01
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Method for Fabricating a Semiconductor Device Having a Heat Radiation Layer Including Forming Scribe Lines and Dicing
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.