Patent Assignment
Reel/Frame 015287/0355
Assignment of Assignor's Interest
Recorded: 2004-04-29
Pages: 3
Assignor
YOO, CHEOL-JOON
Executed: 2004-03-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Stack Type Ball Grid Array Package and Method for Manufacturing the Same