IP Library Assignment 015287/0391
Patent Assignment
Reel/Frame 015287/0391

Assignment of Assignor's Interest

Recorded: 2004-04-29 Pages: 2
Assignor
YAJIMA, TSUKASA
Executed: 2004-04-01
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property (1)
Structure of Semiconductor Element and Its Manufacturing Process
Patent: 7,034,396 →
Application: 10/834,070 →
Publication: US 2005/0121780
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Dec 24, 2008
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022052/0797 →
Change of Name Mar 21, 2014
From: OKI SEMICONDUCTOR CO., LTD
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0483 →