Patent Assignment
Reel/Frame 015287/0921
Assignment of Assignor's Interest
Recorded: 2004-04-30
Pages: 3
Assignors
SEKI, KAZUMITSU
Executed: 2004-04-19
YOSHIE, TAKASHI
Executed: 2004-04-19
SATO, HARUNOBU
Executed: 2004-04-19
MIYAHARA, YOSHIHITO
Executed: 2004-04-19
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO 381-2287, JAPAN
Covered Property
(1)
Packaging Component and Semiconductor Package