Patent Assignment
Reel/Frame 015303/0210
Assignment of Assignor's Interest
Recorded: 2004-10-28
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Filling Trenches Using High-Density Plasma Deposition (Hdp)