Patent Assignment
Reel/Frame 015314/0253
Assignment of Assignor's Interest
Recorded: 2004-05-11
Pages: 3
Assignor
YOON, TAE-SUNG
Executed: 2004-04-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Wafer-Level Chip-Size Package and Molding Apparatus Used in the Method