Patent Assignment
Reel/Frame 015319/0643
Assignment of Assignor's Interest
Recorded: 2004-05-05
Pages: 3
Assignor
NAKATANI, SEIICHI
Executed: 2004-04-20
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006, OAZA KADOMA, KADOMA-SHI, OSAKA 571-8501, JAPAN
Covered Property
(1)
Electronic Component Packaging Structure and Method for Producing the Same