Patent Assignment
Reel/Frame 015335/0777
Assignment of Assignor's Interest
Recorded: 2004-05-17
Pages: 64
Assignor
ASML US INC.
Executed: 2003-10-10
Assignee
THERMAL ACQUISITION CORP.
440 KINGS VILLAGE ROAD, SCOTTS VALLEY, CALIFORNIA, 95066
Covered Property
(1)
Method of Making Low Kappa Dielectric Inorganic/Organic Hybrid Films
Patent:
6,068,884 →
Application:
09/067,704 →
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 17, 2004
From: SILICON VALLEY GROUP, THERMAL SYSTEMS, LLC
To: SILICON VALLEY GROUP, INC.
Reel/Frame 015328/0681 →
Change of Name
May 17, 2004
From: THERMAL ACQUISITION CORP.
To: AVIZA TECHNOLOGY, INC.
Reel/Frame 015328/0708 →
Change of Name
Jan 6, 2005
From: SILICON VALLEY GROUP, INC.
To: ASML US, INC.
Reel/Frame 016116/0847 →
Intellectual Property Security Agreement
May 9, 2007
From: AVIZA TECHNOLOGY, INC.; AVIZA, INC.
To: UNITED COMMERCIAL BANK
Reel/Frame 019265/0381 →
Assignment of Assignor's Interest
May 7, 2010
From: AVIZA, INC.
To: APPLIED MATERIALS, INC.
Reel/Frame 024351/0669 →
Assignment of Assignor's Interest
Jun 17, 2010
From: AVIZA TECHNOLOGY, INC.
To: APPLIED MATERIALS, INC.
Reel/Frame 024555/0417 →