Patent Assignment
Reel/Frame 019265/0381
Intellectual Property Security Agreement
Recorded: 2007-05-09
Received: 2007-05-09
Pages: 27
Assignee
UNITED COMMERCIAL BANK
5201 GREAT AMERICA PARKWAY, #300, SANTA CLARA, CA, 95054-1140, UNITED STATES
Covered Properties
(41)
Method of Increasing the Spatial Resolution of Touch Sensitive Devices
Application:
11/203,692 →
Acoustic Resonators
Application:
10/997,864 →
Depositing a Tantalum Film
Application:
10/483,805 →
Gas Distribution System
Application:
10/854,869 →
Low Dielectric Constant Layers
Application:
10/482,971 →
Two-Step Atomic Layer Deposition of Copper Layers
Application:
10/686,898 →
Method of Depositing a Layer
Application:
10/654,404 →
Dielectric Layer for a Semiconductor Device and Method of Producing the Same
Application:
10/638,424 →
Method of Forming an Acoustic Resonator
Application:
10/637,654 →
Low Kappa Dielectric Inorganic/Organic Hybrid Films and Method of Making
Application:
10/637,913 →
Deposition Methods and Apparatus
Application:
10/464,468 →
Dielectric Film
Application:
10/460,310 →
System and Method for Hydrogen-Rich Selective Oxidation
Application:
10/456,850 →
Method of Treating an Insulating Layer
Application:
10/438,876 →
Shutter
Application:
10/434,190 →
Plasma Processing Apparatus
Application:
10/419,113 →
Barrier Layer and Method of Depositing a Barrier Layer
Application:
10/367,850 →
Plasma Processing Apparatus
Application:
10/364,343 →
Method of Depositing Dielectric
Application:
10/336,923 →
High Flow Rate Bubbler System and Method
Application:
10/306,205 →
Method of Forming a Patterned Metal Layer
Application:
10/290,283 →
Hot Wall Rapid Thermal Processor
Application:
10/261,963 →
Hot Wall Rapid Thermal Processor
Application:
10/262,215 →
Methods of Forming Nitride Films
Application:
10/242,762 →
Atmospheric Pressure Wafer Processing Reactor Having an Internal Pressure Control System and Method
Application:
10/226,773 →
Electrostatic Clamping
Application:
10/182,869 →
Modular Injector and Exhaust Assembly
Application:
10/194,639 →
Method of Etching a Substrate
Application:
10/106,823 →
System and Method to Control Radial Delta Temperature
Application:
10/095,974 →
Inertial Temperature Control System and Method
Application:
10/068,127 →
Multilayer High Kappa Dielectric Films
Application:
10/056,625 →
Apparatus and Method for Chemical Mechanical Polishing of Substrates
Application:
10/029,158 →
Semiconductor Wafer Processing System with Vertically-Stacked Process Chambers and Single-Axis Dual-Wafer Transfer System
Application:
09/996,869 →
Dielectric Layer for a Semiconductor Device and Method of Producing the Same
Application:
09/942,933 →
Hot Wall Rapid Thermal Processor
Application:
09/934,952 →
High Pressure Seal
Application:
09/901,615 →
Method of Cooling an Induction Coil
Application:
09/834,880 →
Inductive Coil Assembly Having Multiple Coil Segments for Plasma Processing Apparatus
Application:
09/673,081 →
Methods and Apparatus for Forming a Film on a Substrate
Application:
09/760,820 →
Single Body Injector and Deposition Chamber
Application:
09/757,542 →
Apparatus for Processing Workpieces
Application:
09/446,432 →