Patent Assignment
Reel/Frame 015343/0385
Assignment of Assignor's Interest
Recorded: 2004-05-14
Pages: 5
Assignors
HUANG, CHIEN-PING
Executed: 2004-05-11
HSIAO, CHENG-HSU
Executed: 2004-05-11
HUANG, CHIH-MING
Executed: 2004-05-11
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO. 123, SEC 3, DA FONG ROAD, TANTZU, TAICHUNG HSIEN, R.O.C., TAIWAN
Covered Property
(1)
Wafer Level Semiconductor Package with Build-Up Layer and Method for Fabricating the Same