IP Library › Assignment 015375/0623
Patent Assignment
Reel/Frame 015375/0623

Assignment of Assignor's Interest

Recorded: 2004-11-12 Pages: 3
Assignors
RAJAGOPALAN, NAGARAJAN
Executed: 2004-11-04
SHEK, MEIYEE
Executed: 2004-11-04
LEE, ALBERT
Executed: 2004-11-05
LAKSHMANAN, ANNAMALAI
Executed: 2004-11-04
XIA, LI-QUN
Executed: 2004-11-03
CUI, ZHEN JIANG
Executed: 2004-11-03
Assignee
APPLIED MATERIALS, INC.
P.O. BOX 450-A, SANTA CLARA, CALIFORNIA, 95052
Covered Property (1)
Adhesion Improvement for Low K Dielectrics to Conductive Materials
Patent: 7,229,911 →
Application: 10/929,884 →
Publication: US 2006/0046479