Patent Assignment
Reel/Frame 015401/0797
Assignment of Assignor's Interest
Recorded: 2004-05-27
Pages: 3
Assignor
HARA, KAZUMI
Executed: 2004-05-13
Assignee
SEIKO EPSON CORPORATION
4-1 NISHI-SHINJUKU, 2-CHOME, SHINJUKU-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Chip, and Semiconductor Wafer Including a Variable Thickness Insulating Layer
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.