Patent Assignment
Reel/Frame 015426/0187
Assignment of Assignor's Interest
Recorded: 2004-06-02
Pages: 3
Assignor
NOSAKA, HITOSHI
Executed: 2004-05-21
Assignee
SEIKO EPSON CORPORATION
4-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, JAPAN
Covered Property
(1)
Wire Bonding Method and Wire Bonding Apparatus