Patent Assignment
Reel/Frame 015433/0869
Assignment of Assignor's Interest
Recorded: 2004-12-07
Pages: 2
Assignor
HUMPSTON, GILES
Executed: 2004-12-01
Assignee
TESSERA, INC.
3099 ORCHARD DRIVE, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Structure and Method of Making Capped Chips Including Vertical Interconnects Having Stud Bumps Engaged to Surfaces of Said Caps
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →