Patent Assignment
Reel/Frame 015444/0562
Assignment of Assignor's Interest
Recorded: 2004-06-08
Pages: 3
Assignors
KANG, SA-YOON
Executed: 2004-05-17
KIM, DONG-HAN
Executed: 2004-05-17
CHUNG, YE-CHUNG
Executed: 2004-05-17
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Low-Cost Flexible Film Package Module and Method of Manufacturing the Same