IP Library Assignment 015471/0611
Patent Assignment
Reel/Frame 015471/0611

Assignment of Assignor's Interest

Recorded: 2004-12-16 Pages: 4
Assignors
HILL, RICHARD
Executed: 2004-01-07
STRADER, JASON
Executed: 2004-01-07
Assignee
THERMAGON, INC.
4707 DETROIT AVENUE, CLEVELAND, OHIO, 44102-2216
Covered Property (1)
Thermal Interface Assembly and Method for Forming a Thermal Interface Between a Microelectronic Component Package and Heat Sink
Patent: 7,369,411 →
Application: 10/752,614 →
Publication: US 2005/0073816
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Mar 31, 2017
From: THERMAGON, INC.
To: LAIRD TECHNOLGIES, INC.
Reel/Frame 041803/0831 →