Patent Assignment
Reel/Frame 015476/0060
Assignment of Assignor's Interest
Recorded: 2004-06-14
Pages: 7
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY,, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Underfill and Encapsulation of Semiconductor Assemblies with Materials Having Differing Properties