Patent Assignment
Reel/Frame 015489/0688
Assignment of Assignor's Interest
Recorded: 2004-06-18
Pages: 2
Assignee
DISCO CORPORATION
14-3, HIGASHI KOJIYA 2-CHOME, OTA-KU, TOKYO 144-8650, JAPAN
Covered Property
(1)
Semiconductor Wafer Dividing Method Utilizing Laser Beam