Patent Assignment
Reel/Frame 015513/0444
Assignment of Assignor's Interest
Recorded: 2004-06-22
Pages: 3
Assignors
YAMADA, SHUNSUKE
Executed: 2004-06-10
HATTORI, MASAKAZU
Executed: 2004-06-10
FUNAHASHI, HAJIME
Executed: 2004-06-10
Assignee
FUJI POLYMER INDUSTRIES CO., LTD.
21-11, CHIYODA 5-CHOME, NAKA-KU, NAGOYA-SHI, AICHI 460-0012, JAPAN
Covered Property
(1)
Thermal Conductive Composition, a Heat Dissipating Putty Sheet and Heat Dissipating Structure Using the Same