Patent Assignment
Reel/Frame 015513/0693
Assignment of Assignor's Interest
Recorded: 2004-06-23
Pages: 3
Assignors
LEE, YONG-GILL
Executed: 2004-04-26
PARK, HYUNG-JUN
Executed: 2004-04-26
PARK, SANG-BAE
Executed: 2004-04-26
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
NO. 26, CHIN 3RD., NANTZE EXPORT, PROCESSING ZPNE, KAOHSIUNG, R.O.C., TAIWAN
Covered Property
(1)
Process for Manufacturing Leadless Semiconductor Packages Including an Electrical Test in a Matrix of a Leadless Leadframe