Patent Assignment
Reel/Frame 015519/0109
Assignment of Assignor's Interest
Recorded: 2004-06-25
Received: 2004-07-02
Pages: 5
Assignee
S.O.I. TEC SILICON ON INSULATOR TECHNOLOGIES S.A.
PARC TECHNOLOGIQUE DES FONTAINES, CHEMIN DES FRANQUES, 38190 BERNIN, FRX, FRANCE
Covered Property
(1)
Methods for preparing a bonding surface of a semiconductor wafer
Application:
10/875,233 →