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App. No. 10/875,233 · Confirmation No. 8448

Methods for preparing a bonding surface of a semiconductor wafer

Abandoned -- Failure to Respond to an Office Action View Publication ↗
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 Code Description Pages PDF
2006-10-17 ABN Abandonment 2 View
2006-06-21 XT/ Extension of Time 1 View
2006-01-24 CTNF Non-Final Rejection 10 View
2006-01-24 1449 List of References cited by applicant and considered by examiner 2 View
2006-01-24 892 List of references cited by examiner 1 View
2006-01-24 BIB Bibliographic Data Sheet 1 View
2006-01-24 SRFW Search information including classification, databases and other search related notes 1 View
2005-12-06 SRNT Examiner's search strategy and results 2 View
2005-07-22 IDS Information Disclosure Statement (IDS) Form (SB08) 2 View
2005-07-22 FOR Foreign Reference 6 View
2005-07-22 FOR Foreign Reference 13 View
2004-12-22 IDS Information Disclosure Statement (IDS) Form (SB08) 2 View
2004-12-22 FOR Foreign Reference 13 View
2004-12-22 FOR Foreign Reference 14 View
2004-12-22 FOR Foreign Reference 18 View
2004-11-24 IDS Information Disclosure Statement (IDS) Form (SB08) 3 View
2004-11-24 FOR Foreign Reference 15 View
2004-11-24 FOR Foreign Reference 47 View
2004-11-24 FOR Foreign Reference 11 View
2004-06-25 TRNA Transmittal of New Application 2 View
2004-06-25 SPEC Specification 12 View
2004-06-25 CLM Claims 3 View
2004-06-25 ABST Abstract 1 View
2004-06-25 DRW Drawings-only black and white line drawings 2 View
2004-06-25 OATH Oath or Declaration filed 4 View
2004-06-25 IDS Information Disclosure Statement (IDS) Form (SB08) 2 View
2004-06-25 WFEE Fee Worksheet (SB06) 1 View
2004-06-25 WFEE Fee Worksheet (SB06) 1 View
2004-06-25 FRPR Certified Copy of Foreign Priority Application 28 View
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Quick Facts
App. No.
10/875,233
Filed
2004-06-25
Pub. No.
US20050218111A1
Art Unit
1765