IP Library › Assignment 015520/0703
Patent Assignment
Reel/Frame 015520/0703

Assignment of Assignor's Interest

Recorded: 2005-01-03 Pages: 7
Assignors
FJELSTAD, JOSEPH C.
Executed: 2004-12-16
SEGARAM, PARA K.
Executed: 2004-12-16
GRUNDY, KEVIN P.
Executed: 2004-12-15
Assignee
SILICON PIPE, INC.
992 SOUTH DE ANZA BLVD., SUITE 201, SAN JOSE, CALIFORNIA, 95129
Covered Property (1)
Multi-Surface Ic Packaging Structures and Methods for Their Manufacture
Patent: 7,061,096 →
Application: 10/947,686 →
Publication: US 2005/0093127
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Foreclosure by Secure Note Holders Aug 7, 2008
From: SILICON PIPE, INC.
To: SECURE NOTE HOLDERS: DAN ANDERSON, JOSEPH FJELSTAD, KEVIN GRUNDY, LAURANCE GRUNDY, MATT STEPOVICH
Reel/Frame 021380/0276 →
Assignment of Assignor's Interest Oct 24, 2008
From: HOLDERS, SECURE NOTE; ANDERSON, DAN; FJELSTAD, JOE; GRUNDY, KEVIN
To: NOVIAS, LLC
Reel/Frame 021744/0512 →
Assignment of Assignor's Interest Nov 18, 2008
From: NOVIAS LLC
To: INTERCONNECT PORTFOLIO, LLC
Reel/Frame 021861/0127 →
License Mar 4, 2009
From: INTERCONNECT PORTFOLIO LLC
To: TECHNOLOGY PROPERTIES LIMITED LLC
Reel/Frame 022343/0351 →
Assignment of Assignor's Interest Oct 7, 2010
From: TECHNOLOGY PROPERTIES LIMITED
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 025105/0596 →
Assignment of Assignor's Interest Oct 7, 2010
From: INTERCONNECT PORTFOLIO, LLC; INTELLASYS BEC LIMITED; TECHNOLOGY PROPERTIES LIMITED
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 025105/0634 →