Patent Assignment
Reel/Frame 022343/0351
License
Recorded: 2009-03-04
Pages: 10
Assignor
INTERCONNECT PORTFOLIO LLC
Executed: 2008-03-15
Assignee
TECHNOLOGY PROPERTIES LIMITED LLC
20400 STEVENS CREEK BLVD., FIFTH FLOOR, CUPERTINO, CALIFORNIA, 95014
Covered Properties
(38)
Transmission Line Structure with an Air Dielectric
Method of Bonding a Semiconductor Die Without an Esd Circuit and a Separate Esd Circuit to an External Lead, and a Semiconductor Device Made Thereby
Direct-Connect Integrated Circuit Signaling System for Bypassing Intra-Substrate Printed Circuit Signal Paths
Array Connector with Deflectable Coupling Structure for Mating with Other Components
Patent:
6,884,120 →
Application:
10/608,255 →
Multi-Path via Interconnection Structures and Methods for Manufacturing the Same
Patent:
6,891,272 →
Application:
10/632,730 →
System for Making High-Speed Connections to Board-Mounted Modules
Memory Chain
Memory System Having a Multiplexed High-Speed Channel
Low Profile Discrete Electronic Components and Applications of Same
Patent:
7,701,323 →
Application:
10/857,830 →
Multi-Surface Ic Packaging Structures and Methods for Their Manufacture
Multi-Surface Contact Ic Packaging Structures and Assemblies
Structures and Methods for Wire Bonding Over Active, Brittle and Low K Dielectric Areas of an Ic Chip
Patent:
7,176,580 →
Application:
10/973,172 →
Partitioned Integrated Circuit Package with Central Clock Driver
Patent:
7,279,783 →
Application:
10/977,355 →
Tapered Dielectric and Conductor Structures and Applications Thereof
Stair Step Printed Circuit Board Structures for High Speed Signal Transmissions
Insulating Substrate for Ic Packages Having Integral Esd Protection
Interconnect System Without Through-Holes
High Speed, Direct Path, Stair-Step, Electronic Connectors with Improved Signal Integrity Characteristics and Methods for Their Manufacture
Ic Packaging Interposer Having Controlled Impedance or Optical Interconnections and an Integral Heat Spreader
Patent:
7,310,239 →
Application:
11/062,112 →
Active Connector
Electrical Interconnection Devices Incorporating Redundant Contact Points for Reducing Capacitive Stubs and Improved Signal Integrity
Signal-Segregating Connector System
Torsionally-Induced Contact-Force Conductors for Electrical Connector Systems
Ic Package Structures Having Separate Circuit Interconnection Structures and Assemblies Constructed Thereof
Multi-Surface Ic Packaging Structures and Methods for Their Manufacture
Memory Packages Having Stair Step Interconnection Layers
Electrical Interconnection Devices Incorporating Redundant Contact Points for Reducing Capacitive Stubs and Improved Signal Integrity
Signal-Segregating Connector System
High Speed, Direct Path, Stair-Step, Electronic Connectors with Improved Signal Integrity Characteristics and Methods for Their Manufacture
Partitioned Integrated Circuit Package with Central Clock Driver
Application:
11/868,963 →
Publication:
US 2009/0091017
Direct-Connect Signaling System
Memory Systems Including Memory Devices Coupled Together in a Daisy-Chained Arrangement
Cabled Signaling System and Components Thereof
Memory Ic Package Assembly Having Stair Step Metal Layer and Apertures
Electrical Interconnection Devices Incorporating Redundant Contact Points for Reducing Capacitive Stubs and Improved Signal Integrity
Tapered Dielectric and Conductor Structures and Applications Thereof
Integrated Circuit Packages and Electrical Assemblies Having Stair Step Interconnection Layers
Application:
12/335,372 →
Publication:
US 2009/0091019
Controlled Impedance Structures for High Density Interconnections
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 16, 2003
From: SEGARAM, PARA KANAGASABAI; FJELSTAD, JOSEPH; HABA, BELGACEM
To: SILICON PIPE
Reel/Frame 014179/0765 →
Assignment of Assignor's Interest
Jul 28, 2003
From: FJELSTAD, JOSEPH C.; SEGARAM, PARA K.; HABA, BELGACEM
To: SILICON PIPE, INC.
Reel/Frame 014318/0775 →
Assignment of Assignor's Interest
Jan 13, 2004
From: GRUNDY, KEVIN P.; SEGARAM, PARA K.
To: SILICON PIPE, INC.
Reel/Frame 014895/0177 →
Assignment of Assignor's Interest
Mar 8, 2004
From: FJELSTAD, JOSEPH C.; HABA, BELGACEM
To: SILICON PIPE, INC.
Reel/Frame 014403/0609 →
Assignment of Assignor's Interest
Mar 8, 2004
From: HABA, BELGACEM; SEGARAM, PARA K.; FJELSTAD, JOSEPH C.
To: SILICON PIPE, INC.
Reel/Frame 014403/0606 →
Assignment of Assignor's Interest
Sep 20, 2004
From: GRUNDY, KEVIN P.; SEGARAM, PARA K.
To: SILICON PIPE, INC.
Reel/Frame 015149/0285 →
Assignment of Assignor's Interest
Sep 29, 2004
From: FJELSTED, JOSEPH C.; GRUNDY, KEVIN P.; SEGARAM, PARA K.; WEIDEMANN, WILLIAM F.
To: SILICON PIPE, INC.
Reel/Frame 015198/0923 →
Assignment of Assignor's Interest
Oct 5, 2004
From: OBENHUBER, INESSA
To: SILICONPIPE, INC.
Reel/Frame 015220/0513 →
Assignment of Assignor's Interest
Oct 25, 2004
From: FJELSTAD, JOSEPH
To: SILICONPIPE, INC
Reel/Frame 015934/0574 →
Assignment of Assignor's Interest
Jan 3, 2005
From: FJELSTAD, JOSEPH C.; SEGARAM, PARA K.; OBENHUBER, INESSA (EXECUTOR OF THE ESTATE OF THOMAS J. OBENHUBER); GRUNDY, KEVIN P.
To: SILICON PIPE, INC.
Reel/Frame 015520/0703 →
Assignment of Assignor's Interest
Jan 3, 2005
From: FJELSTAD, JOSEPH C.; SEGARAM, PARA K.; OBENHUBER, INESSA (EXECUTOR OF THE ESTATES OF THOMAS J. OBENHUBER); GRUNDY, KEVIN P.
To: SILICONE PIPE, INC.
Reel/Frame 015520/0760 →
Assignment of Assignor's Interest
Jan 3, 2005
From: FJELSTAD, JOSEPH C.; GRUNDY, KEVIN P.; SEGARAM, PARA K.; OBENHUBER, INESSA (EXECUTOR OF THE ESTATE OF THOMAS J. OBENHUBER)
To: SILICON PIPE, INC.
Reel/Frame 015520/0953 →
Assignment of Assignor's Interest
Jan 7, 2005
From: FJELSTAD, JOSEPH C.; GRUNDY, KEVIN P.
To: SILICON PIPE, INC.
Reel/Frame 016166/0053 →
Assignment of Assignor's Interest
Jan 26, 2005
From: GRUNDY, KEVIN P.; WIEDEMANN, WILLIAM F.; FJELSTAD, JOSEPH C.
To: SILICON PIPE, INC.
Reel/Frame 015624/0098 →
Assignment of Assignor's Interest
Mar 10, 2005
From: FJELSTAD, JOSEPH C.; GRUNDY, KEVIN P.; SEGARAM, PARA K.; YASUMURA, GARY
To: SILICON PIPE, INC.
Reel/Frame 015869/0886 →
Assignment of Assignor's Interest
May 9, 2005
From: GRUNDY, KEVIN P.; FJELSTAD, JOSEPH C.; YASUMURA, GARY; WIEDEMANN, WILLIAM F.
To: SILICON PIPE, INC.
Reel/Frame 016203/0790 →
Assignment of Assignor's Interest
May 23, 2005
From: FJELSTAD, JOSEPH C.; GRUNDY, KEVIN P.
To: SILICON PIPE, INC.
Reel/Frame 016268/0036 →
Assignment of Assignor's Interest
Jun 14, 2005
From: YASUMURA, GARY; FJELSTAD, JOSEPH C.; WIEDEMANN, WILLIAM F.; SEGARAM, PARA K.
To: SILICON PIPE, INC.
Reel/Frame 016333/0704 →
Foreclosure by Secure Note Holders
Aug 7, 2008
From: SILICON PIPE, INC.
To: SECURE NOTE HOLDERS: DAN ANDERSON, JOSEPH FJELSTAD, KEVIN GRUNDY, LAURANCE GRUNDY, MATT STEPOVICH
Reel/Frame 021380/0276 →
Assignment of Assignor's Interest
Aug 7, 2008
From: SILICON PIPE, INC.
To: SECURE NOTE HOLDERS: DAN ANDERSON, JOSEPH FJELSTAD, KEVIN GRUNDY, LAURANCE GRUNDY, MATT STEPOVICH
Reel/Frame 021380/0249 →
Assignment of Assignor's Interest
Oct 23, 2008
From: ANDERSON, DAN; FJELSTAD, JOE; GRUNDY, KEVIN; GRUNDY, LAWRENCE
To: NOVIAS, LLC
Reel/Frame 021731/0712 →
Assignment of Assignor's Interest
Oct 24, 2008
From: HOLDERS, SECURE NOTE; ANDERSON, DAN; FJELSTAD, JOE; GRUNDY, KEVIN
To: NOVIAS, LLC
Reel/Frame 021744/0512 →
Assignment of Assignor's Interest
Nov 18, 2008
From: NOVIAS LLC
To: INTERCONNECT PORTFOLIO, LLC
Reel/Frame 021861/0127 →
Assignment of Assignor's Interest
Nov 18, 2008
From: NOVIAS, LLC
To: INTERCONNECT PORTFOLIO, LLC
Reel/Frame 021861/0111 →
Assignment of Assignor's Interest
Oct 7, 2010
From: INTERCONNECT PORTFOLIO, LLC; INTELLASYS BEC LIMITED; TECHNOLOGY PROPERTIES LIMITED
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 025105/0634 →