Patent Assignment
Reel/Frame 015934/0574
Assignment of Assignor's Interest
Recorded: 2004-10-25
Pages: 3
Assignor
FJELSTAD, JOSEPH
Executed: 2004-10-25
Assignee
SILICONPIPE, INC
992 SOUTH DE ANZA BLVD, SUITE 201, SAN JOSE, CALIFORNIA, 95129
Covered Property
(1)
Structures and Methods for Wire Bonding Over Active, Brittle and Low K Dielectric Areas of an Ic Chip
Patent:
7,176,580 →
Application:
10/973,172 →
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Foreclosure by Secure Note Holders
Aug 7, 2008
From: SILICON PIPE, INC.
To: SECURE NOTE HOLDERS: DAN ANDERSON, JOSEPH FJELSTAD, KEVIN GRUNDY, LAURANCE GRUNDY, MATT STEPOVICH
Reel/Frame 021380/0276 →
Assignment of Assignor's Interest
Oct 24, 2008
From: HOLDERS, SECURE NOTE; ANDERSON, DAN; FJELSTAD, JOE; GRUNDY, KEVIN
To: NOVIAS, LLC
Reel/Frame 021744/0512 →
Assignment of Assignor's Interest
Nov 18, 2008
From: NOVIAS LLC
To: INTERCONNECT PORTFOLIO, LLC
Reel/Frame 021861/0127 →
License
Mar 4, 2009
From: INTERCONNECT PORTFOLIO LLC
To: TECHNOLOGY PROPERTIES LIMITED LLC
Reel/Frame 022343/0351 →
Assignment of Assignor's Interest
Oct 7, 2010
From: TECHNOLOGY PROPERTIES LIMITED
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 025105/0596 →
Assignment of Assignor's Interest
Oct 7, 2010
From: INTERCONNECT PORTFOLIO, LLC; INTELLASYS BEC LIMITED; TECHNOLOGY PROPERTIES LIMITED
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 025105/0634 →