Multi-surface IC packaging structures and methods for their manufacture
View Patent ↗An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.
1. An IC package assembly comprising:
at least one IC chip having a first surface with a plurality of die terminals disposed thereupon, the first surface being disposed within a first plane;
a plurality of IC package terminals including first and second IC package terminals disposed on at least one planar package surface parallel to the first plane;
a plurality of discrete interconnecting elements, each discrete interconnecting element coupling a die terminal with a corresponding IC package terminal, including first and second discrete interconnecting elements coupled to respective first and second IC die terminals, wherein the first and second discrete interconnecting elements intersect a common line perpendicular to the first plane; and
an insulation material surrounding, supporting, insulating and separating the discrete interconnecting elements, wherein a path of at least one of the interconnecting elements is oriented at an oblique angle relative to the first plane.
2. The IC package assembly of claim 1 , where the plurality of IC package terminals are located pseudo randomly on at least one surface of the package assembly.
3. The IC package assembly of claim 1 , wherein said at least one IC chip comprises first and second IC chips.
4. The IC package assembly of claim 3 , wherein the first and second IC chips are not electrically connected to one another within the first IC package.
5. The IC package assembly of claim 3 , wherein the first and second IC chips are electrically interconnected within the encapsulating insulation material.
6. The IC package assembly of claim 5 , wherein second IC chip is not directly interconnected to an external I/O terminal by a bond wire.
7. An assembly comprising a first IC package that includes:
a first IC die having a first surface oriented within a first plane, the first surface including a first a plurality of I/O terminals disposed thereupon;
at least one IC package surface that is parallel with the first plane;
a plurality of next level electrical interconnectors, including first and second next level interconnectors that intersect the at least one IC package surface; and
a plurality of bond wires with a first end electrically coupled to a respective I/O terminal and a second end electrically coupled to a respective next level electrical connector, including first and second bond wires coupled with the first and second next level connectors, wherein the first and second bond wires intersect a line perpendicular to the first plane, wherein the first bond wire is electrically insulated from the second bond wire by an encapsulant, and wherein a path of the first bond wire is oriented at an oblique angle relative to the first surface of the first IC die.
8. The assembly of claim 7 , wherein at least some of the next level electrical connectors comprise an elongated rigid member extending outward from the encapsulant in cantilever fashion.
9. The assembly of claim 8 , wherein at least some of the elongated rigid members terminate at corresponding conductive pads.
10. The assembly of claim 9 , wherein at least some of the conductive pads are arranged in a common plane.
11. The assembly of claim 7 , wherein at least some of the next level electrical connectors comprise contact surfaces arranged in a stair step configuration.
12. The assembly of claim 7 , further comprising a rigid layer having first and second surfaces, the second surface of the rigid layer being coupled to a surface of the IC die.
13. The assembly of claim 12 , wherein the rigid layer is configured to function as a heat spreader.
14. The assembly of claim 12 , wherein the rigid layer is a substrate layer.
15. The assembly of claim 14 , further comprising a heat spreader coupled to the first surface of the substrate layer.
16. The assembly of claim 15 , wherein at least one of the next level connectors terminates in a conductive terminal disposed on a surface of the substrate layer, and wherein the heat spreader comprises holes positioned to expose the at least one conductive terminal.
17. The assembly of claim 7 , wherein at least some of the next level electrical connectors terminate at corresponding IC package terminals disposed on a surface of the encapsulant.
18. The assembly of claim 7 , further comprising:
(a) a printed circuit board electrically coupled to at least one I/O terminal of the first IC package;
(b) a second IC package having a first conductive pad electrically coupled to the printed circuit board and a second conductive pad electrically coupled to a conductive pad of the first IC package by means of a connecting member.
19. The assembly of claim 18 wherein the connecting member is a controlled impedance cable.
20. The IC package assembly according to claim 1 wherein at least one of the discrete interconnecting elements is an electrically conductive wire bond.
21. The IC package assembly of claim 1 , wherein the at least one IC chip further comprises a side surface perpendicular to the first surface, and wherein a first section of a first discrete interconnecting element is disposed at an oblique angle relative to the side surface.
22. The assembly of claim 7 , wherein the at least one IC die further comprises a side surface perpendicular to the first planar surface, and wherein a first section of the first connecting element is disposed at an oblique angle relative to the side surface.