Patent Assignment
Reel/Frame 014179/0765
Assignment of Assignor's Interest
Recorded: 2003-06-16
Pages: 4
Assignors
SEGARAM, PARA KANAGASABAI
Executed: 2003-05-27
FJELSTAD, JOSEPH
Executed: 2003-05-27
HABA, BELGACEM
Executed: 2003-05-27
Assignee
SILICON PIPE
650 SARATOGA AVENUE, SAN JOSE, CALIFORNIA, 95129
Covered Property
(1)
Method of Bonding a Semiconductor Die Without an Esd Circuit and a Separate Esd Circuit to an External Lead, and a Semiconductor Device Made Thereby
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Foreclosure by Secure Note Holders
Aug 7, 2008
From: SILICON PIPE, INC.
To: SECURE NOTE HOLDERS: DAN ANDERSON, JOSEPH FJELSTAD, KEVIN GRUNDY, LAURANCE GRUNDY, MATT STEPOVICH
Reel/Frame 021380/0276 →
Assignment of Assignor's Interest
Oct 24, 2008
From: HOLDERS, SECURE NOTE; ANDERSON, DAN; FJELSTAD, JOE; GRUNDY, KEVIN
To: NOVIAS, LLC
Reel/Frame 021744/0512 →
Assignment of Assignor's Interest
Nov 18, 2008
From: NOVIAS LLC
To: INTERCONNECT PORTFOLIO, LLC
Reel/Frame 021861/0127 →
License
Mar 4, 2009
From: INTERCONNECT PORTFOLIO LLC
To: TECHNOLOGY PROPERTIES LIMITED LLC
Reel/Frame 022343/0351 →
Assignment of Assignor's Interest
Oct 7, 2010
From: TECHNOLOGY PROPERTIES LIMITED
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 025105/0596 →
Assignment of Assignor's Interest
Oct 7, 2010
From: INTERCONNECT PORTFOLIO, LLC; INTELLASYS BEC LIMITED; TECHNOLOGY PROPERTIES LIMITED
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 025105/0634 →