Patent Assignment
Reel/Frame 016333/0704
Assignment of Assignor's Interest
Recorded: 2005-06-14
Pages: 7
Assignors
YASUMURA, GARY
Executed: 2005-05-19
FJELSTAD, JOSEPH C.
Executed: 2005-05-19
WIEDEMANN, WILLIAM F.
Executed: 2005-06-01
SEGARAM, PARA K.
Executed: 2005-06-08
GRUNDY, KEVIN P.
Executed: 2005-05-19
Assignee
SILICON PIPE, INC.
992 SOUTH DE ANZA BLVD., SUITE 201, SAN JOSE, CALIFORNIA, 95129
Covered Property
(1)
High Speed, Direct Path, Stair-Step, Electronic Connectors with Improved Signal Integrity Characteristics and Methods for Their Manufacture
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 7, 2008
From: SILICON PIPE, INC.
To: SECURE NOTE HOLDERS: DAN ANDERSON, JOSEPH FJELSTAD, KEVIN GRUNDY, LAURANCE GRUNDY, MATT STEPOVICH
Reel/Frame 021380/0249 →
Assignment of Assignor's Interest
Oct 23, 2008
From: ANDERSON, DAN; FJELSTAD, JOE; GRUNDY, KEVIN; GRUNDY, LAWRENCE
To: NOVIAS, LLC
Reel/Frame 021731/0712 →
Assignment of Assignor's Interest
Nov 18, 2008
From: NOVIAS, LLC
To: INTERCONNECT PORTFOLIO, LLC
Reel/Frame 021861/0111 →
License
Mar 4, 2009
From: INTERCONNECT PORTFOLIO LLC
To: TECHNOLOGY PROPERTIES LIMITED LLC
Reel/Frame 022343/0351 →
Assignment of Assignor's Interest
Oct 7, 2010
From: TECHNOLOGY PROPERTIES LIMITED
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 025105/0596 →
Assignment of Assignor's Interest
Oct 7, 2010
From: INTERCONNECT PORTFOLIO, LLC; INTELLASYS BEC LIMITED; TECHNOLOGY PROPERTIES LIMITED
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 025105/0634 →