Patent Assignment
Reel/Frame 021731/0712
Assignment of Assignor's Interest
Recorded: 2008-10-23
Pages: 6
Assignors
ANDERSON, DAN
Executed: 2008-03-01
FJELSTAD, JOE
Executed: 2008-03-01
GRUNDY, KEVIN
Executed: 2008-03-01
GRUNDY, LAWRENCE
Executed: 2008-03-01
STEPOVICH, MATT
Executed: 2008-03-01
Assignee
NOVIAS, LLC
43525 VISTA MAR, FREEMONT, CALIFORNIA, 94539
Covered Properties
(12)
High Speed, Direct Path, Stair-Step, Electronic Connectors with Improved Signal Integrity Characteristics and Methods for Their Manufacture
Ic Packaging Interposer Having Controlled Impedance or Optical Interconnections and an Integral Heat Spreader
Patent:
7,310,239 →
Application:
11/062,112 →
Active Connector
Electrical Interconnection Devices Incorporating Redundant Contact Points for Reducing Capacitive Stubs and Improved Signal Integrity
Signal-Segregating Connector System
Electrical Interconnection Devices Incorporating Redundant Contact Points for Reducing Capacitive Stubs and Improved Signal Integrity
Memory Systems Including Memory Devices Coupled Together in a Daisy-Chained Arrangement
Cabled Signaling System and Components Thereof
Memory Ic Package Assembly Having Stair Step Metal Layer and Apertures
Electrical Interconnection Devices Incorporating Redundant Contact Points for Reducing Capacitive Stubs and Improved Signal Integrity
Tapered Dielectric and Conductor Structures and Applications Thereof
Controlled Impedance Structures for High Density Interconnections
Application:
61/018,495 →
Related Assignments
(18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 28, 2005
From: GRUNDY, KEVIN P.; YASUMURA, GARY
To: SILICON PIPE, INC.
Reel/Frame 016420/0159 →
Assignment of Assignor's Interest
May 23, 2005
From: FJELSTAD, JOSEPH C.; GRUNDY, KEVIN P.
To: SILICON PIPE, INC.
Reel/Frame 016268/0036 →
Assignment of Assignor's Interest
Jun 14, 2005
From: YASUMURA, GARY; FJELSTAD, JOSEPH C.; GRUNDY, KEVIN P.; WIEDEMANN, WILLIAM F.
To: SILICON PIPE, INC.
Reel/Frame 016335/0168 →
Assignment of Assignor's Interest
Jun 14, 2005
From: YASUMURA, GARY; FJELSTAD, JOSEPH C.; WIEDEMANN, WILLIAM F.; SEGARAM, PARA K.
To: SILICON PIPE, INC.
Reel/Frame 016333/0704 →
Redacted Assignment Agreement
Nov 16, 2005
From: SEGARAM, PARA K.
To: SILICON PIPE, INC.
Reel/Frame 017027/0030 →
Assignment of Assignor's Interest
Jan 18, 2006
From: GRUNDY, KEVIN P; YASUMURA, GARY; WIEDMANN, WILLIAM F; FJELSTAD, JOSEPH C
To: SILICONPIPE, INC.
Reel/Frame 017032/0143 →
Assignment of Assignor's Interest
May 14, 2008
From: GRUNDY, KEVIN P.; SEGARAM, PARA KANAGASABIE
To: SILICON PIPE
Reel/Frame 020959/0645 →
Assignment of Assignor's Interest
May 14, 2008
From: FJELSTAD, JOSEPH CHARLES; SEGARAM, PARA KANAGASABIE; OBENHUBER, THOMAS; WIEDEMANN, WILLIAM F.
To: SILICON PIPE
Reel/Frame 020960/0513 →
Assignment of Assignor's Interest
May 14, 2008
From: YASUMURA, GARY; FJELSTAD, JOSEPH CHARLES; GRUNDY, KEVIN P.; WIEDEMANN, WILLIAM F.
To: SILICON PIPE
Reel/Frame 020959/0320 →
Assignment of Assignor's Interest
Jul 28, 2008
From: FJELSTAD, JOSEPH CHARLES; SEGARAM, PARA KANAGASABIE; YASUMURA, GARY; GRUNDY, KEVIN P.
To: SILICON PIPE
Reel/Frame 021315/0682 →
Assignment of Assignor's Interest
Jul 28, 2008
From: FJELSTAD, JOSEPH CHARLES; GRUNDY, KEVIN P.
To: SILICON PIPE
Reel/Frame 021314/0864 →
Assignment of Assignor's Interest
Jul 28, 2008
From: FJELSTAD, JOSEPH CHARLES
To: SILICON PIPE
Reel/Frame 021315/0350 →
Assignment of Assignor's Interest
Jul 28, 2008
From: FJELSTAD, JOSEPH CHARLES; GRUNDY, KEVIN P.; WIEDEMANN, WILLIAM F.; YASUMURA, GARY
To: SILICON PIPE
Reel/Frame 021315/0934 →
Assignment of Assignor's Interest
Aug 7, 2008
From: SILICON PIPE, INC.
To: SECURE NOTE HOLDERS: DAN ANDERSON, JOSEPH FJELSTAD, KEVIN GRUNDY, LAURANCE GRUNDY, MATT STEPOVICH
Reel/Frame 021380/0249 →
Assignment of Assignor's Interest
Nov 18, 2008
From: NOVIAS, LLC
To: INTERCONNECT PORTFOLIO, LLC
Reel/Frame 021861/0111 →
License
Mar 4, 2009
From: INTERCONNECT PORTFOLIO LLC
To: TECHNOLOGY PROPERTIES LIMITED LLC
Reel/Frame 022343/0351 →
Assignment of Assignor's Interest
Oct 7, 2010
From: TECHNOLOGY PROPERTIES LIMITED
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 025105/0596 →
Assignment of Assignor's Interest
Oct 7, 2010
From: INTERCONNECT PORTFOLIO, LLC; INTELLASYS BEC LIMITED; TECHNOLOGY PROPERTIES LIMITED
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 025105/0634 →