IP Library Granted Patent US 7,404,746
Granted Patent B2
US 7,404,746 · App. 11/607,143 · Granted Jul 29, 2008

Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity

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Quick Facts
Patent No.
US 7,404,746
App. No.
11/607,143
Granted
Jul 29, 2008
Kind
B2
Abstract

An electrical interconnection device for establishing redundant contacts between the ends of two conductive elements to be mated, creating a electrical interconnection without capacitive stubs.

Claims (26)

1. An electrical interconnection assembly comprising:

a first mounting structure;

a first conductive element having (i) a first linear section and (ii) a first curved resilient section, wherein the first linear section is disposed against the mounting structure and wherein, in an absence of force upon the first curved resilient section, the first curved resilient section curves away from the mounting structure, (iii) a first tip formed at a distal end of the first curved resilient section, (iv) a first landing zone disposed along at least a portion of the first conductive element; and,

a second conductive element having (i) a second linear section and (ii) a second curved resilient section, (iii) a second tip at the distal end of the second curved resilient section, and (iv) a second landing zone, wherein the second tip is in electrical contact with the first landing zone, and the first tip is in electrical contact with the second landing zone, the interconnection assembly configured such that, when the first conductive element is mated with the second conductive element by a progressively increasing force, the first curled resilient section progressively uncurls, thereby progressively increasing the length of the first linear section.

2. The electrical interconnection device of claim 1 wherein the first tip comprises a linear edge formed by an intersection of the distal end of the first conductive element and a lower surface of the first curved resilient section.

3. The electrical interconnection device of claim 1 wherein the second conductive element comprises a second curved resilient section that ends at the second tip.

4. The electrical interconnection device of claim 1 further comprising at least one supporting structure that aligns the first conductive element and the counterpart conductive element when they are moved together.

5. The electrical interconnection device of claim 1 wherein the first conductive element is configured to mate with the counterpart conductive element disposed on a surface configured as a stair step for mating with other stair step structures.

6. The electrical interconnection device of claim 1 further comprising at least one structure for controlling a flexure of the first curved resilient section of the first conductive element when the first conductive element is mated to the second conductive element.

7. The electrical interconnection device of claim 1 wherein the first conductive element tapers to a point.

8. The electrical interconnection device of claim 1 wherein the mounting structure comprises at least one of a printed circuit board, a substrate, a connector body, and an integrated circuit device.

9. The electrical interconnection device of claim 1 wherein a section of the first conductive element extending between the first tip and the second tip and a section of the second conductive element between the first tip and the second tip form an electrically conductive closed loop.

10. The electrical interconnection assembly of claim 1 , the first conductive element further comprising a second curved resilient section extending outward from the linear section, the second curved resilient section terminating in a third tip.

11. The electrical interconnection assembly of claim 1 wherein the first tip comprises a forked shape.

12. The electrical interconnection assembly of claim 1 wherein the first tip is disposed on a step surface of a stair step electrical contact assembly.

13. The electrical interconnection device of claim 2 wherein a surface of the distal end is substantially perpendicular to the lower surface of the curved resilient region such that the linear edge is a ninety-degree edge.

14. The electrical interconnection device of claim 6 wherein the first mounting structure extends in such a way that, as the first curved resilient section gradually uncurls, newly formed segments of the linear section are disposed against, and aligned with, the first mounting structure.

15. The electrical interconnection device of claim 14 wherein the first conductive element is configured such that, as a force is applied to the device, a distance across the electrically conductive closed loop decreases from a point on the first conductive element to a point on the second conductive element, the first migrates along the second landing zone, creating contact wipe.

16. The electrical interconnection device in claim 15 , wherein the second conductive element is configured such that, as a distance across the electrically conductive closed loop decreases from a point on the first conductive element to a point on the second conductive element, the second tip migrates across the first landing zone, creating contact wipe.

17. The electrical interconnection assembly of claim 10 wherein the linear section consists essentially of a single linear sub-section, such that the first curved resilient section and the second curved resilient section extend outward from the linear section in opposite directions.

18. The electrical interconnection assembly of claim 10 wherein the linear section comprises first and second linear sub-sections intersecting at an angle, such that the first curved resilient section and the second curved resilient section extend outward from the linear section at an angle relative to each other.

19. The electrical interconnection assembly of claim 18 wherein the linear section is bent at approximately 90 degrees, forming first and second linear sub-sections aligned at an angle of approximately 90 degrees relative to each other.

20. An electrical interconnection assembly comprising:

first and second mounting structures;

a first conductive element having (i) a first linear section and (ii) a first curved resilient section extending from the first linear section, wherein at least a portion of the first linear section is secured to the first mounting structure and the first curved resilient section is not secured to the mounting structure, (iii) a first tip formed at a distal end of the first curved resilient section, (iv) a first landing zone disposed along at least a portion of the first conductive element; and,

a second conductive element having (1) a second linear section and (ii) a second curved resilient section extending from the second linear section, wherein at least a portion of the second linear section is secured to a second mounting structure and the second curved resilient section is not secured to the mounting structure; (iii), a second tip formed at the distal end of the second curved resilient section, and (iv) a second landing zone disposed along at least a portion of the second conductive element, wherein the second tip is in electrical contact with the first landing zone, and the first tip is in electrical contact with the second landing zone, the interconnection assembly configured such that as the first and second linear section are urged toward each other, the first and second curved resilient sections progressively uncurl, and wherein a portion of the first curved resilient section in an uncurled state will be aligned with the first linear region.

Assignments (7)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 7, 2010
From: TECHNOLOGY PROPERTIES LIMITED
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 025105/0596 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 7, 2010
From: INTERCONNECT PORTFOLIO, LLC; INTELLASYS BEC LIMITED; TECHNOLOGY PROPERTIES LIMITED
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 025105/0634 →
LICENSE Recorded Mar 4, 2009
From: INTERCONNECT PORTFOLIO LLC
To: TECHNOLOGY PROPERTIES LIMITED LLC
Reel/Frame 022343/0351 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 18, 2008
From: NOVIAS, LLC
To: INTERCONNECT PORTFOLIO, LLC
Reel/Frame 021861/0111 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 23, 2008
From: ANDERSON, DAN; FJELSTAD, JOE; GRUNDY, KEVIN; GRUNDY, LAWRENCE; STEPOVICH, MATT
To: NOVIAS, LLC
Reel/Frame 021731/0712 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 7, 2008
From: SILICON PIPE, INC.
To: SECURE NOTE HOLDERS: DAN ANDERSON, JOSEPH FJELSTAD, KEVIN GRUNDY, LAURANCE GRUNDY, MATT STEPOVICH
Reel/Frame 021380/0249 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 14, 2008
From: YASUMURA, GARY; FJELSTAD, JOSEPH CHARLES; GRUNDY, KEVIN P.; WIEDEMANN, WILLIAM F.; STEPOVICH, MATTHEW J.
To: SILICON PIPE
Reel/Frame 020959/0320 →