IP Library Assignment 021315/0350
Patent Assignment
Reel/Frame 021315/0350

Assignment of Assignor's Interest

Recorded: 2008-07-28 Pages: 5
Assignor
FJELSTAD, JOSEPH CHARLES
Executed: 2002-05-23
Assignee
SILICON PIPE
992 SOUTH DE ANZA BLVD., SUITE 201, SAN JOSE, CALIFORNIA, 95129
Covered Property (1)
Memory Ic Package Assembly Having Stair Step Metal Layer and Apertures
Patent: 7,948,093 →
Application: 11/965,705 →
Publication: US 2008/0211071
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 7, 2008
From: SILICON PIPE, INC.
To: SECURE NOTE HOLDERS: DAN ANDERSON, JOSEPH FJELSTAD, KEVIN GRUNDY, LAURANCE GRUNDY, MATT STEPOVICH
Reel/Frame 021380/0249 →
Assignment of Assignor's Interest Oct 23, 2008
From: ANDERSON, DAN; FJELSTAD, JOE; GRUNDY, KEVIN; GRUNDY, LAWRENCE
To: NOVIAS, LLC
Reel/Frame 021731/0712 →
Assignment of Assignor's Interest Nov 18, 2008
From: NOVIAS, LLC
To: INTERCONNECT PORTFOLIO, LLC
Reel/Frame 021861/0111 →
License Mar 4, 2009
From: INTERCONNECT PORTFOLIO LLC
To: TECHNOLOGY PROPERTIES LIMITED LLC
Reel/Frame 022343/0351 →
Assignment of Assignor's Interest Oct 7, 2010
From: TECHNOLOGY PROPERTIES LIMITED
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 025105/0596 →
Assignment of Assignor's Interest Oct 7, 2010
From: INTERCONNECT PORTFOLIO, LLC; INTELLASYS BEC LIMITED; TECHNOLOGY PROPERTIES LIMITED
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 025105/0634 →