Tapered dielectric and conductor structures and applications thereof
View Patent ↗Disclosed are tapered dielectric and conductor structures which provide controlled impedance interconnection while signal conductor lines transition from finer pitches to coarser pitches thereby obviating electrical discontinuities generally associated with changes of circuit contact pitch. Also disclosed are methods for the construction of the devices and applications therefore.
1. An electronic interconnection structure for electrically interconnecting a first group of electrical terminals with a second group of electrical terminal at a controlled characteristic impedance, the interconnection structure comprising:
a plurality of signal conductors including a first signal conductor, each signal conductor having a first end and a second end, the signal conductors being arranged in a fixed spatial relationship to each other such that an arrangement of first ends collectively form a coarser pitch terminal group, and such that the signal conductors converge from the coarser pitch terminal group to a finer pitch terminals group formed by the second ends of the signal conductors, wherein the coarser pitch terminals are exposed, and spatially arranged to provide simultaneous access to all coarser pitch terminals;
a first dielectric layer having a tapered thickness;
a first signal conductor disposed on a first surface of the first dielectric layer and having a tapered width; and
a first conductive grounding layer disposed on a surface of the first dielectric layer opposite the first surface.
2. The electronic interconnection structure of claim 1 wherein the first signal conductor is tapered to a progressively narrower width over a region of the first dielectric layer that tapers to a progressively narrower thickness to provide a substantially uniform characteristic impedance along the length of the first signal conductor.
3. The electronic interconnection structure of claim 1 further comprising a second dielectric layer having a tapered thickness and having a first surface disposed adjacent the first surface of the first dielectric layer to sandwich the first signal conductor therebetween.
4. The electronic interconnection structure of claim 1 further comprising a second grounding layer disposed on a second surface of the second dielectric layer, the second surface of the second dielectric layer being opposite the first surface of the second dielectric layer.
5. The electronic interconnection structure of claim 4 further comprising:
a third dielectric layer having a tapered thickness and having a first surface disposed adjacent the second surface of the second dielectric layer to sandwich the second grounding layer therebetween; and
a second signal conductor having a tapered width and disposed on a surface of the third dielectric layer opposite the first surface of the third dielectric layer.
6. The electronic interconnection structure of claim 5 wherein each of the first and second signal conductors is exposed at both first and second ends.