Patent Assignment
Reel/Frame 015524/0369
Assignment of Assignor's Interest
Recorded: 2004-06-25
Pages: 2
Assignor
ONG, ADRIAN E.
Executed: 2004-06-23
Assignee
INAPAC TECHNOLOGY, INC.
2290 NORTH FIRST STREET, SUITE 201, SAN JOSE, CALIFORNIA, 95131
Covered Property
(1)
Multiple Power Levels for a Chip Within a Multi-Chip Semiconductor Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.