Assignment of Assignor's Interest

Recorded: 2004-07-15 Pages: 2

Assignor

SEIKO INSTRUMENTS, INC.

Executed: 2004-06-29

Assignee

SII NANOTECHNOLOGY, INC.

8, NAKASE 1-CHOME, MIHAMA-KU, CHIBA-SHI, CHIBA, JAPAN

Covered Property (1)

Thin Piece Forming Method

Patent: 6,527,967 →

Application: 09/356,234 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.